Ok, surgery complete...
Lapping the NB took the back seat for a week or two, in the mean time I whacked a new hole in the side of my case for a 92mm fan. I'm glad I did wait b/c lapping the NB took forever!!!
I spent around 6 hours on and off- my arm could only take so much at a time. I used enduro's technique by attaching the sandpaper to the bottom of my already lapped NB-1C.
The 400 grit sandpaper couldn't take it off fast enough and I was low on 400 grit... opps
So I didn't get down to the very center. After my testing I'm not disappointed that I didn't take the time to get it completely flat.
Here are the b4 and after pics...
Even after lapping my problems continued with usb and network errors at 250fsb... then i tried 245... same thing... the system would continue to prime even though the mouse became unresponsive. System would still memtest perfectly fine at these speeds.
I ended up @ 240fsb prime blend stable... not too bad. I am also running only 1.65vdd... being able to use a lower voltage
could be the result of lapping the NB and better heat transfer between the chip and heatsink but who knows for sure, the board might have been stable @ 1.65vdd b4.
Now I'm gonna see if I can get 240x10.5 or 240x11 out of it. I fear 240x11 is going to take 2v or more to be stable and I don't want to run my cpu at that kind of voltage- I do want this rig to last for a while.
So cetoole, if you seem to already be hitting the wall with your fsb and have already done the vdd mod... my experience shouldn't convince you to take the time to lap your NB. Not unless you just want better heat transfer, I wouldn't bother.